Solder paste S3X series

copperfor electrical componentshigh-temperature

6-month shelf life at 25℃, inhibiting metallic salts. New technology for room temperature storage Chemical reactions between solder powders and flux occurring in solder paste at room temperature are minimized, which effectively eliminates issues such as thickening and enables long-term storage at room temperature. Maintains viscosity in harsh temperature conditions Improves workability and avoids quality changes during transportation Room temperature storage eliminates concerns such as "quality change in continual use", "wait period after taking out of the refrigerator", and "degradation for forgetting to put into a refrigerator". Significant improvement in production efficiency and higher cost benefits by reducing waste amount can be achieved. Product Performance Table Product Name - S3X58-M406ECO / S3X48-M406ECO Product Category - Solder Paste Melting Point(℃) - 217-219 Particle Size（μm） - 20-38 / 20-45 Viscosity（Pa.s） - 210 Flux Content(%) - 11.5 Halide content(%) - 0 Flux Type - ROL0 (IPC J-STD-004)