Composite material adhesive JU-110-3

single-componentfor printed circuit boards

REACH compliant SMT adhesive for dispensing JU-110-3 Applicable to 1005 chip components Stable and tall deposits ensure contact even with 1005 chip components JU-110-3 ensures excellent shape retention, enabling continual application of tall print deposits. Therefore, contact with surface-mounted components of any shape is achieved, improving reliability of the wave soldering process. Resistant to heat slump JU-110-3 is resistant against heat slump, maintaining the height of deposits throughout the process. The height of deposits and contact with surface-mounted components are maintained even during heating, securely holding the components in place. Compliant to REACH regulation JU-110-3 has significantly reduced the content of one of the substances of very high concern (SVHC) as regulated by the European Chemical Agency (ECHA), and is compliant to the REACH regulation. Product Performance Table Product Name - JU-110-3 Product Category - Heat Curable SMT Adhesive State / Color - Paste, red Transition Temperature(℃) - 90 Curing condition - 130ºC, >60sec. Shelf life (0-10℃) - 6 months