Solder paste S1XBIG58-M500-4

jointNickel basedsilver based

SAC305 reflow profile applicable halogen free low Ag solder paste S1XBIG58-M500-4 Sn 1.1Ag 0.7Cu 1.8Bi + Ni Achieved joint reliability superior to SAC305 The only difference from SAC305 is "low cost" A very small amount of two modifying elements Bi and Ni are added. Different effects from these elements achieved strong and easy-to-use low Ag solder that is equivalent to or superior to SAC305, such as the melting point, thermal resistance, and time-dependent change in crystal structures.Click here for the mechanism of hybrid reinforcement. Maintains thermal-fatigue resistance for a long time IMCs containing Ni (yellow points in the diagram on the right) finely disperse among Sn crystals and prevents growth of Sn crystals due to thermal shocks. Therefore, S1XBIG/S01XBIG makes a clear distinction from SAC305 also for its "long-lasting robustness" not just temporary withstandability. Reflow profile of SAC305 applicable The melting point of S1XBIG is 211-223oC. By adding KOKI's newly developed flux into the mix, the temperature profile of SAC305 has become applicable to S1XBIG. S1XBIG is flexible solder paste which is low in Ag yet has workability as high as conventional products. Product Performance Table Product Name - S1XBIG58-M500-4 Product Category - Solder Paste Melting Point(℃) - 211-223 Particle Size（μm） - 20-38 Viscosity（Pa.s） - 220 Flux Content(%) - 11.2 Halide content(%) - 0 Flux Type - ROL0 (IPC J-STD-004B)