Solder paste S01XBIG58-M500-4

jointcoppersilver based

"Hybrid" high reliability halogen free low Ag solder paste S01XBIG58-M500-4 Sn 0.1Ag 0.7Cu 1.6Bi + Ni Achieved joint reliability superior to SAC305 The only difference from SAC305 is "low cost" A very small amount of two modifying elements Bi and Ni are added. Different effects from these elements achieved strong and easy-to-use low Ag solder that is equivalent to or superior to SAC305, such as the melting point, thermal resistance, and time-dependent change in crystal structures.Click here for the mechanism of hybrid reinforcement. Maintains thermal-fatigue resistance for a long time IMCs containing Ni (yellow points in he diagram on the right) finely disperse among Sn crystals and prevents growth of Sn crystals due to thermal shocks. Therefore, S1XBIG/S01XBIG makes a clear distinction from SAC305 also for its "long-lasting robustness" not just temporary withstandability. Achieved both low-Ag and halogen-free KOKI strives to respond to customers' requests for cost cutting and to become, as a company that sets a high value on environmental conservation, a good partner of all customers who are considerate to the environment. Therefore, all our low Ag products have halogen free versions in their line-up. Product Performance Table Product Name - S01XBIG58-M500-4 Product Category - Solder Paste Melting Point(℃) - 211-227 Particle Size（μm） - 20-38 Viscosity（Pa.s） - 220 Flux Content(%) - 11.2 Halide content(%) - 0 Flux Type - ROL0 (IPC J-STD-004A)