Joint paste S1XBIG58-M650-7

soldercopperNickel based

Low Ag containing, SAC305 profile applicable solder paste S1XBIG58-M650-7 Sn 1.1Ag 0.7Cu 1.8Bi+Ni Testing Probe Stays Clean. High ICT first pass yield S1XBIG58-M650-7 prevents the buildup of thick and sticky flux residue over the solder joint, which helps the testing probe to get the accurate readings to improve the first pass rate. Superior wetting ability prevents voiding For smaller components such as QFNs, micro BGA and LGA, bigger voids could occupy majority of the pad area thus creating a possible weak link for failure. S1XBIG58-M650-7 has specially designed flux to effectively reduce the amount of gas generated thereby minimize the amount of voids. "Halogen-free" addressing the environment One keyword of environmental measures is "halogen-free"; these days companies demand final products to be halogen-free. Halogen-free S1XBIG58-M650-7 meets such demands while providing both reliability and workability. roduct Performance Table Product Name - S1XBIG58-M650-7 Product Category - Solder Paste Composition - Sn 1.1Ag 0.7Cu 1.8Bi+Ni Melting Point(℃) - 211-223 Particle Size（μm） - 20-38 Viscosity（Pa.s） - 200 Flux Content(%) - 11.2 Halide content(%) - 0 Flux Type - ROL0