Solder paste SB6NX58-HF350

coppersilver basedfor electrical components

True Halogen Free High Reliability Alloy Solder Paste SB6N58-HF350 Highly thermal stress resistant Halogen free (ROL0) by IPC J-STD-004B Increasing demand for high thermal stress For PCBs exposed to severe temperature fluctuation, long term durable alloys are required to counter thermal cycling induced stress. Solid solution strengthening in Sn phase Indium does not form compound with Sn but replace the Sn atom (from solid solution). As atomic radius of In is significantly larger than Sn, it generates strain in atomic structure and prevent Sn atom dislocation. Product Performance Table Product Name - SB6N58-HF350 Product Category - Solder Paste Composition - Sn 3.5Ag 0.5Bi 6.0In Melting Point(℃) - 202-210 Particle Size（μm） - 20 - 38 Viscosity（Pa.s） - 200±30 Flux Content(%) - 11.0±1.0 Halide content(%) - 0 Flux Type - ROL0