Solder paste GSP

copper basedsilver basedfor electrical components

Solder paste developed in collaboration with TOYOTA Corporation GSP Sn 3.0Ag 0.5Cu Crack-Free residue technology for reliable auto-applications No residue washing or coating required GSP's crack-free flux residue acts as a coating and prevents condensation and contamination at joints. Therefore, residue washing or coating is not needed. The number of processes will be reduced, and significant cost benefit can be anticipated. Wets lead ends GSP exerts excellent wettability even to lead ends which are generally not plated and considered poorly wettable and contributes to improving the first time quality. Reliable insulation in condensing environments GSP maintains excellent insulation reliability in condensing tests conducted after thermal cycling tests (-40/+125ºC x 1000cycles). GSP's crack-free flux residue prevents moisture absorption to joints, ensuring superb electrical reliability. Product Performance Table Product Name - GSP Product Category - Solder Paste Melting Point(℃) - 217-219 Particle Size（μm） - 20-38 Viscosity（Pa.s） - 160 Flux Content(%) - 10.9 Halide content(%) - 0.06 Flux Type - ROM1 (IPC J-STD-004)