Solder paste S3X70-M500D

copper basedsilver basedfor electrical components

Dispensing solder paste for super find pitch and micro components S3X70-M500D Sn 3.0Ag 0.5Cu Solder the right "Spot".Not "Area" soldering. Uniformly spherical solder powder The reason why graping often occurs while using fine particle solder paste is an increase in the amount of oxide layers due to a larger amount of fine particles printed. S3X70-M500D minimizes the amount of oxide layers by selecting fine and spherical solder powders under strict quality checks, in order to retain high meltability. Consistent deposit shape even in long-term uses Carefully selected solder powder and flux of highly consistent viscosity in continual use maintain fine print shapes even in long-term uses. Superbly low voiding for any component S3X70-M500D is designed to maintain its activity for a long period of time. During reflow, by removing voids in a long span, S3X70-M500D realizes low voiding for any component. Product Performance Table Product Name - S3X70-M500D Product Category - Solder Paste Composition - Sn 3.0Ag 0.5Cu Melting Point(℃) - 217-219 Particle Size（μm） - 10-25 Viscosity（Pa.s） - 100 Flux Content(%) - 14.0 Halide content(%) - 0 Flux Type - ROL0 (IPC J-STD-004A) Characteristics - Application:Dispensing