Epoxy adhesive JU-90LT-3

for plasticssingle-component

Reduces Thermal Stress on the Components and Board Low curing temperature mitigates damage to the PCB and the components JU-90LT-3 cures at low temperatures around 90-100℃, reducing the level of oxidation for the components and substrate. It enables improvement in the overall product quality and first time product quality. [ Curing Condition and Bonding Strength ] Stable dispense shape and height, superior heat slump resistance Dispense shape of JU-90LT-3 is stable during continuous dispensing. The dispense shape and height after 10000 shots are practically the same as the initial shots. Furthermore, the diameter of a dispensed adhesive was only approx. 4.7% larger after being cured at 90℃ for 90 sec.* *according to our in-house test [ Heat Slump Property / Curing condition: 90℃ x 90 sec. ] Excellent electrical reliability after curing, suitable for fine-pitch patterns JU-90LT-3 after curing shows good surface insulation resistance, making it suitable for use in fine-pitch patterns. In the biased humidity test with temp. 85℃ and humidity 85%, JU-90LT-3 indicates good insulation resistance well after 1000 hours without any trace of electrical migration.