Joint paste SB6NX58-M500SI

soldercoppersilver based

Excellent Durability Against Heat Cycle Stress Ideal for extreme environments SAC type solder joint cannot comply with longer product life requirement for such application that are exposed to significant higher temperatures. To make a much stronger, fatigue resistant joint possible, solid solution strengthening of Sn crystal lattice is facilitated by addition of In and Bi. ■Elements (Bi,In) added Recommended for ENIG finish In ENIG finish, Sn-Ni IMC layer thickens and along with concentration of P causes the joint interface brittle.By adding Ni-compatible Cu, SB6NX forms a Ni barrier layer and effectively prevents the thickening of Sn-Ni IMC layer, realizing high joint reliability with ENIG finish. ■Effect of added Cu For the better joint reliability In comparison with SAC305, SB6NX has better elongation property and is less prone to deformation. That helps to prevent propagation of crack at the solder joint in thermal cycling. As found below, SB6NX shows much higher sheer strength than SAC305 with ENIG and OSP substrate alike. ■Stress strength after T/C Product Performance Table Product Name SB6NX58-M500SI Product Category Solder Paste Composition Sn 3.5Ag 0.5Bi 6.0In 0.8Cu Melting Point(℃) 202 - 204 Particle Size（μm） 20-38 Viscosity（Pa.s） 200 Flux Content(%) 11.0 Halide content(%) 0 Flux Type ROL0 (IPC J-STD-004A) Characteristics for Dispense : SB6NX58-M500SID