Solder paste S3X70-G835

copper basedsilver basedfor electrical components

Applicable to 0402 chip component with AIR reflow atmosphere. Reduces defects during stencil printing with a newly developed lubrication technique S3X70-G835 adopts a type of non-volatile solvent as its primary constituent, and can keep itself from drying when the paste is left idle. A better print-to-pause property results, ensuring a consistent printability and workability even after a 60-min. pause. [ Print-to-pause property ] Evaluate transfer rate of printed solder paste volume before and after leaving on a stencil. ・Substrate: FR-4　・Stencil thickness: 0.08mm (laser cut) ・Stencil aperture: 0.18mm dia. Pattern　・Squeegee angle: 60° Excellent meltability and wettability on micro-patterns in air reflow Although the size of the S3X70-G835 solder particle is Type 5, the product exhibits good meltability and wettability without a Nitrogen atmosphere. This has been enabled by a newly engineered flux formulation optimized for Type 5 powders. [ Reflow test in Air atmosphere ] ・Substrate: FR-4 ・Stencil thickness: 0.08mm ・Stencil aperture: 0.175mm dia. , 0402R ・Aperture ratio: 100% ・Pad surface finish: Cu-OSP ・Heating method: Hot air reflow ・Reflow atmosphere: Air Reduced voids with various board surface finish treatments In addition to having good melting properties, S3X70-G835 displays excellent wetting performance on various board surface finishes. This helps the molten solder to quickly push out flux elements, and reduces the occurrence of voids as a result. Product Performance Table