- Materials - Tools - Components
- Semi-finished products
- Joint paste
- Koki Company Limited
Joint paste E12 soldercopper basedsilver based
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Characteristics
- Function
- joint, solder
- Material
- copper based, silver based
- Applications
- for electrical components
- Other characteristics
- high-temperature
Description
Solder Paste for IGBT / MOSFET
Module Manufacturing
that Requires No Cleaning
Ultimately Low Voiding
E12 series ensures extremely low voiding regardless of the type of solder alloy.
Also, it does not cause solder to splatter even with 600μm thick stencil.
Got Problems with Solder Splattering?
E12 series ensures stable and consistent soldering performance with ultra low voiding and low splattering even
on a large joint area which commonly requires a thick stencil specially for a power semiconductor device application.
VIDEO
Catalogs
S3X58-CF100-2
1 Pages
T4AB58-HF360
1 Pages
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.