Solder paste SB6N58-HF350

silver basedfor electrical componentshigh-temperature

Highly thermal stress resistant Halogen free (ROL0) by IPC J-STD-004B Increasing demand for high thermal stress For PCBs exposed to severe temperature fluctuation, long term durable alloys are required to counter thermal cycling induced stress. ■ Mechanism of crack occurrence by thermal cycling stress Solid solution strengthening in Sn phase Indium does not form compound with Sn but replace the Sn atom (from solid solution). As atomic radius of In is significantly larger than Sn, it generates strain in atomic structure and prevent Sn atom dislocation. Activator technique enables viscosity stability, powerful wetting, and high SIR Product Performance Table Product Name SB6N58-HF350 Product Category Solder Paste Composition Sn 3.5Ag 0.5Bi 6.0In Melting Point(℃) 202-210 Particle Size（μm） 20 - 38 Viscosity（Pa.s） 200 Flux Content(%) 11.0 Halide content(%) 0 Flux Type ROL0