Joint paste SB6N58-M500SI

soldersilver basedfor electrical components

Highly thermal stress resistant alloy with indium Increasing demand for high thermal stress durability For PCBs exposed to severe temperature fluctuation, long term durable alloys are required to counter thermal cycling induced stress. ■ Mechanism of crack occurrence by thermal cycling stress Absorption of mechanical stress by addition of indium SB6N58 M500S1 adopted 6% indium to balance and optimize thermal stress and deformation character̶ istics, which could occur if excessively added. ■ Difference of deformation temperature by Indium content Remarkable joint reliability ■ Shear strength ( 40⇔ 150°C for 30min. each) & Cross sectional view (After 1500 cycles) Product Performance Table Product Name SB6N58-M500SI Product Category Solder Paste Composition Sn 3.5Ag 0.5Bi 6.0ln Melting Point(℃) 202-210 Particle Size（μm） 20-38 Viscosity（Pa.s） 200 Flux Content(%) 11.1 Halide content(%) 0 Flux Type ROL0 Characteristics for Dispense : SB6N58-M500SID