Chamber oven SO2-12-F

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This clean oven processes 300-mm (12-inch) wafers for semiconductor production. With FOUPs, 50 wafers can be fully automatically processed for each chamber. The system can be used for low-temperature processing of polyimide and other materials. Features Fully automatic clean oven for FOUP operation Max 50 wafers per chamber One robot is available for 2 chambers 2 FOUPs per chamber High speed wafer transfer by double wafer handling robot This clean oven for semiconductor production was developed by introducing the best-selling FPD manufacturing equipment, single wafer processing clean oven. This oven can run fully automatically using 300-mm (12-inch) FOUPs. 50 wafers can be processed for each chamber and up to 2 chambers can be installed (2 FOUPs are used for each chamber). High throughput in a short cycle time is realized in low-temperature processing of polyimide and other materials.