Automatic packaging machine APAMA C2S

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The APAMA Chip-to-Substrate (C2S) offers fully Automated solution for Thermo- Compression Bonding (TCB), High Density Fan-Out Wafer Level Packaging (HD FOWLP) and High Accuracy Flip Chip (HA FC). Cost-of-Ownership Advantage Modular designs allow the flexibility of upgrading from HD FOWLP or HA FC to TCB processes enabling effective cost-of-ownership and preserving the investments of our customers. C2S Features & Benefits: Automation Control Placement Accuracy Performance Yield Enhancement Adaptability Cost-of-Ownership Advantage Enterprise & Consumer Applications Network Routers and Switches Servers High-end PCs and Graphics Smartphones and Tablets