Automatic packaging machine APAMA C2W

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CHIP-TO-WAFER (C2W) The APAMA Chip-to-Wafer (C2W) offers fully Automated solution for Thermo-Compression Bonding (TCB), High Density Fan-Out Wafer Level Packaging (HD FOWLP) and High Accuracy Flip Chip (HA FC). Cost-of-Ownership Advantage Modular designs allow the flexibility of upgrading from HD FOWLP or HA FC to TCB processes enabling effective cost-of-ownership and preserving the investments of our customers. C2W Features & Benefits: Automation Control Placement Accuracy Performance Yield Enhancement Adaptability Cost-of-Ownership Advantage Enterprise & Consumer Applications HBM Memory Stacking Network Routers and Switches Servers High-end PCs and Graphics Smartphones and Tablets