RAPID™ MEM introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications.
Key Features:
Real-time Process & Performance Monitoring
Real-time Equipment Health Monitoring
Advanced Data Analytics & Traceability
Predictive Maintenance Monitoring & Analysis
Detection & Enhanced Post bond Inspection
Latest Response Based Processes
- ProAu-2, ProAg-2
- PSP-Ag
- ProOverhang
- Multi-Stitch Bonding
Bondable Area Configurations:
RAPID MEM LA (Large Area)
RAPID MEM ELA (Extended Large Area)