Automatic wire bonder RAPID™ MEM
semi

automatic wire bonder
automatic wire bonder
automatic wire bonder
automatic wire bonder
Add to favorites
Compare this product
 

Characteristics

Options
automatic, semi

Description

RAPID™ MEM introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications. Key Features: Real-time Process & Performance Monitoring Real-time Equipment Health Monitoring Advanced Data Analytics & Traceability Predictive Maintenance Monitoring & Analysis Detection & Enhanced Post bond Inspection Latest Response Based Processes - ProAu-2, ProAg-2 - PSP-Ag - ProOverhang - Multi-Stitch Bonding Bondable Area Configurations: RAPID MEM LA (Large Area) RAPID MEM ELA (Extended Large Area)
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.