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Automatic wire bonder RAPID™semi
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Characteristics
- Options
- automatic, semi
Description
RAPID™ introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications.
Key Features:
Real-time Process & Performance Monitoring
Real-time Equipment Health Monitoring
Advanced Data Analytics & Traceability
Predictive Maintenance Monitoring & Analysis
Detection & Enhanced Post bond Inspection
Bondable Area Configurations:
RAPID LA (Large Area)
RAPID ELA (Extended Large Area)
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.