Automatic wire bonder OptoLux™

high-speed

OptoLux™ high speed wire bonder is the latest generation ball bonder that sets the new standards and benchmark in the LED market. Key Features: High speed X-Y-Z motion control system New Interactive Programmable Look Ahead Vision for ease of set-up during first time Automatic recovery paths for common production stoppages WAVI (Wide Angle Vertical Illumination) system with programmable red and blue lighting Low angle oblique illumination Single magnification optics at 2x Quick-LED Suite Processes and AccuBump-LED Processes Optional Micro Environment kit to support Ag alloy, PdCu or Cu wire