Epoxy die bonder ISTACK S+

for die-attachhigh-accuracy

The iStack™ S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. Its enhanced process features include the face-down process, In-Situ UV and bond force detection mechanism, delivering productivity improvement and performance. Features & Options High Accuracy kit (5 μm) Thin Substrate handling kit (< 100 μm) Mapping Functions (Substrate / Wafer) Wafer / Substrate contamination removal kit OHT / AGV kit SMEMA kit UV (In-Situ / Post-Bond) Tool Contamination monitoring kit