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Fully-automatic die bonder ISTACK W+
for die-attachhigh-accuracy

Fully-automatic die bonder - ISTACK W+ - Kulicke & Soffa - for die-attach / high-accuracy
Fully-automatic die bonder - ISTACK W+ - Kulicke & Soffa - for die-attach / high-accuracy
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Characteristics

Options
fully-automatic, for die-attach, high-accuracy

Description

With an emerging trend in attaching thinner die and substrates, the iStack™ W+ offers a solution for wafer level die attach. Features & Options High Accuracy kit (5 μm) Mapping Functions (Substrate / Wafer) Wafer / Substrate contamination removal kit OHT / AGV kit UV (In-Situ / Post-Bond) Tool Contamination monitoring kit

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Die Attach

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