Wedge bonder wedge bonder ASTERION EV

The Asterion™ EV (Extended Version) wedge bonder is built on a reengineered architecture that includes an expanded bond area, new robust pattern recognition capabilities and extremely tight process controls. Together these deliver heightened productivity, bonding quality, and reliability. The enlarged bondable area enhances flexibility and reduces line integration costs. Asterion is driven by a precise new direct-drive motion system that requires minimum maintenance and delivers high repeatability. The graphical editor, multi-segment bonding, global parameter change, and a library of new software features, make programming and optimizing bonding process of complex devices relatively easier. Key Advantages: Large bondable area (300 x 860 mm) Multi-lane capability No heat applied, all work done at ambient temperatures Consistent process results Low cost-of-ownership with reduced preventive maintenance Supports Industry 4.0 Customized implementation of MES solution