The Ersa Rework System HR 600/3P enables automatic repair of SMT components such as BGA and MLF up to edge lengths of 1 x 1 mm with precision and reliability. HRSoft 2´s graphical user interface enables effortless process selection and operation for any user.
The Technology of Ersa Rework Systems sustainably secures the added value of electronics:
• gentle heating technology
• sensor guided soldering processes
• contactless residual solder removal
• precise component placement
• complete process documentation
• clear user guidanceg
• High-precision axis system (X, Y, Z) and high-resolution cameras
• Automated component placement as well as soldering and desoldering processes
• Hybrid heating head with two heating zones
• Large-area, powerful IR underheating in three zones
• Non-contact temperature measurement with digital sensor
• Three K-type thermocouple inputs for Accu-TC sensor
• Effective assembly cooling with compressed air
• Dimensions (WxDxH) in mm: 850 x 660 x 573
• Weight in kg: 65
• Anstistatic Design (y/n): yes
• Power Rating in W: 3.200
• Nominal Voltage in V AC: 220 V - 240 VAC, 50-60 Hz, 16 A
• Top heating: hybrid radiator 800 W, in two zones, 60 x 60 mm
• Bottom heating: IR heater (3x 800 W), 380 x 250 mm
• Measuring channels: 3x K-type, 1x IRS
• Position laser: Class II
• PCB size in mm: up to 390 x 300 mm (+x), up to 535 x 300 mm (+x), (0HR600/3PL)
• PCB size in mm: 1 x 1 mm up to 60 x 60 mm
• Axis accuracy: up to +/- 25 µm
• Top placement camera: 5 MP GigE color camera
• Component camera bottom: 5 MP GigE black and white camera
• Working distance (typical): 30-60 mm to top heater, 35 mm to bottom heater