Guided rework with high-performance optical system and flexible heating technology
Thanks to guided processes, the Ersa Rework System HR 550 ensures safe rework on the basis of simple and convenient operation. Predicate: visually leading!
The Technology of the Ersa Rework Systems sustainably secures the added value of electronics:
• gentle heating technology
• sensor guided soldering processes
• contactless residual solder removal
• precise component placement
• complete process documentation
• clear user guidance
• Highly efficient 1,800 W hybrid heating head
• Large-area IR bottom heating in 3 heating zones (2,400 W)
• Integrated vacuum pipette for component removal and placement
• Highly accurate placement with integrated force sensor
• Enhanced Visual Assistant (EVA)
• Computer aided component placement
• Process control and documentation via software HRSoft 2
• Suitable for the use of the Dip&Print Station
• Dimensions (W x D x H) in mm: 573 x 765 x 545/747 (heating head down/up)
• Weight in kg: 76
• Antistatic Design (y/n): yes
• Power Rating in W: 4.200
• Nominal voltage in V AC: 230
• Upper heating: Hybrid emitter (900 + 900 W), 70 x 70 mm
• Lower heating: IR emitter (3 x 800 W), 390 x 270 mm
• PCB size in mm: up to 400 x 300 mm (+x) up to 520 x 360 mm (+x) (0HR550L)
• Component size in mm: from 01005 to 70 x 70
• Operation: Windows-PC
• Test symbol: CE
• Option: Reflow process camera: 2,3 MP, CMOS GigE color camera, 25 mm focal length, illumination 2x LED, adjustable