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PCB wireless module Lyra
Bluetooth

PCB wireless module
PCB wireless module
PCB wireless module
PCB wireless module
PCB wireless module
PCB wireless module
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Bluetooth, PCB

Description

The newest addition to Ezurio's (formerly Laird Connectivity) extensive Bluetooth Low Energy product range is the Lyra Series, based on Silicon Labs EFR32BG22 SoC. This range of flexible modules marries all the benefits of Silicon Labs hardware, software, and tools offerings with Laird Connectivity’s added value application software, services, certification, and support capabilities. This seamless partnership provides customers with multiple software development options suited to their resources and skillsets in Bluetooth LE-enabled product development. The Lyra Series includes small form factor PCB modules, as well as ultra-compact SIP options, to suit any host board footprint. Together, Silicon Labs and Laird Connectivity, will drive down your total cost of ownership, design complexity and risk, whilst ensuring you the fastest time to market for your next Bluetooth LE-enabled IoT design. -True industrial operating range: Designed and certified to the highest industrial temperature range of -40 ºC to +105 ºC for every component utilized. -Global approvals – make yourself at home: Carries several modular FCC, ISED, EU, UKCA, MIC, KC, and Bluetooth SIG approvals. -Low power operation for battery powered IoT: Intelligent power schemes, deep sleep mode, and low power consumption leads to long-performing IoT solutions even on a battery -Security features on EFR32BG22: Secure Boot, ARM Trustzone, Hardware Cryptographic Acceleration Specifications Bluetooth Version 5.3 Low Energy Logical Interfaces UART, I2C, SPI, ADC, GPIO, PWM, PDM, Counter, Timer, Watchdog, PRS Chipset (Wireless) Silicon Labs EFR32BG22

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