1. Electricity - Electronics
  2. Electronic Component
  3. Epoxy resin
  4. Laizhou Weiyi Experiment Machine Manufacturing Co., Ltd.

Hot mounting resin A/B series
epoxylow-viscosity

hot mounting resin
hot mounting resin
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Characteristics

Type
epoxy
Applications
hot mounting
Other characteristics
low-viscosity

Description

Scope of application: Suitable for metal processing industry that cannot be heated or inlaid Hot inlay resin: The cold inlay is directly placed into the silicone or plastic mold, and the resin is cured at room temperature to obtain the inlaid sample. The cold inlaid resin can be dosed according to the demand and injected in the specified time. Inlay mold, batch sample preparation, suitable for the inlay of heat-sensitive and pressure-sensitive materials; cold inlay does not require special inlay equipment, the necessary configuration container and mosaic mold can complete the inlay process The product cures quickly, is translucent, does not require heating, does not require pressure, and is suitable for metal processing industries that cannot be heated or inlaid. Curing time: 20~25 minutes Use ratio: powder 10: liquid 8 Cold setting powder (LYK-A) 1000g/bottle, curing agent (LYK-B) 800ml/bottle, Ф30 cold inlay mold 1, 1 syringe, 20 plastic cups, 40 stirring rods, 1 spoon The product has high flashing, high permeability, excellent toughness, no need for heating, no need for pressurization, and is suitable for metal processing industry that cannot be heated or inlaid. Curing time: 10~15 minutes Use ratio: powder 1: liquid 1 Cold setting powder (LYB-A) 1000g/bottle, curing agent (LYB-B) 800ml/bottle, Ф30 cold inlay mold 1, 1 syringe, 20 plastic cups, 40 stirring rods, 1 spoon

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