Diamond wire saw AWS

for the optics industrycompacthigh-performance

The AWS Abrasive Wire Saw allows fragile or difficult materials to be cut or wafered without sample damage. The saw uses fine lapping and cutting technology to perform cuts with minimal material loss and minimal sample damage. The variable wire speed and cutting load on this saw enables it to be used for a wide range of materials including expensive materials, such as Cadmium Zinc Telluride or YAG laser rods. The AWS Abrasive Wire Saw is a compact, bench-top wire saw and can slice samples up to 100mm (4″) in diameter with a maximum boule/sample length of 100mm (4″). Key Features High cutting performance with minimal material loss High cut quality with minimal material damage Accepts samples up to 100 x 100mm (4″ x 4″) Simple, safe sample mounting