The Logitech WG6 polishing system, comprising of a PM6 or LP70 precision polishing machine and a WG6 polishing head, is capable of producing the desired finished sample to a very high standard. This can be high reflectivity, low relief, ultra-flat surfaces or minimal edge roll off.
This is a highly versatile system, offering a wide range of facilities including variable and carousel speed and rotational direction. With a capacity to polish a batch of up to 6 samples at one time, or individually, using a variety of sample holders, customers can specify their sample holding requirements upon ordering. The WG6 is an ideal system for rock polishing.
PM6 Precision Lapping & Polishing Machine
The system has been designed to enable quick and easy changing of polishing plates. The metered automatic abrasive feed unit automatically supplies polishing fluid to the plate, reducing operator time and product waste. Peristaltic pumps also allow for control over the amount of abrasive fed to the plate, allowing for easy process repeatability.
The intelligent Graphical User Interface (GUI) allows you to control machine functions and set process conditions, such as combined lapping and polishing options and slurry monitoring. Full management of plate speed is set and controlled via the GUI, enabling high levels of process control.
LP70 Multi-station Precision Lapping & Polishing Machine
With a much larger work space capacity, the LP70 system can hold two WG6 polishing heads allowing for the process of up to 12 specimens at one time.