Bonding system

Logitech’s WSBU Wafer Substrate Bonding Units are premium bonders for the processing of fragile semiconductor wafers such as silicon and gallium arsenide. The bonding units are designed to minimise breakage with these expensive materials, whilst retaining the highest quality of sample yield. We offer a wide range of Wafer Substrate Bonding Units (WSBU): Single Station, benchtop WSBU with the capacity to bond 100mm (4″) wafers Single Station, benchtop WSBU with the capacity to bond 150mm (6″) wafers Three Station, benchtop WSBU with the capacity to bond 100mm (4″) wafers Three Station, benchtop WSBU with the capacity to bond 150mm (6″) wafers Single Station, Standing WSBU with the capacity to bond 300mm (12″) wafers Key Features 100mm (4″), 150mm (6″) or 300mm (12″) wafer capacity Single or multiple wafer bonding Process repeatability Automated process cycle Excellent wafer to support disc parallelism