Automatic mini blasting machine mini PFE 100/200

mobile

Wet blasting equipment for thin plate-shaped workpieces. Compact automatic equipment for simultaneous double-sided processing of lead frames and other thin plate-shaped workpieces. Small automatic equipment that processes plate-shaped workpieces. This is a smaller and low-cost version of PFE. Suitable for processing semiconductors, ceramic plates, copper plates, films, etc. We have two types available depending on the workpiece size. Main Applications Semiconductor resin deburring As a pre-treatment for the plating process, the burrs caused at the resin molding of the semiconductor packaging are removed. Removal of overmolding from embedded LED chips A processing application that exposes chips and electrodes by scraping over molded resins such as epoxy. Deburring of LED pacakages By cleaning the burrs and dirt on the LED package, it is prevent loss of reflectance of the reflector surface. Removing non-conductive layers from LTCC boards Removes the glassy nonconductor layer that causes plating defects in LTCC board manufacturing. Improved adhesion of difficult-to-adhere resin materials This pretreatment improves the adhesion strength of difficult-to-adhere resin materials. Flow Inside the Equipent Workpiece loading and unloading are done automatically. Integrated line operation is possible by attaching loading and unloading units to the front and back of the equipment.