X-ray diffractometer X'Pert MRD
high-resolution

X-ray diffractometer - X'Pert MRD  - Malvern Panalytical - high-resolution
X-ray diffractometer - X'Pert MRD  - Malvern Panalytical - high-resolution
X-ray diffractometer - X'Pert MRD  - Malvern Panalytical - high-resolution - image - 2
X-ray diffractometer - X'Pert MRD  - Malvern Panalytical - high-resolution - image - 3
X-ray diffractometer - X'Pert MRD  - Malvern Panalytical - high-resolution - image - 4
X-ray diffractometer - X'Pert MRD  - Malvern Panalytical - high-resolution - image - 5
X-ray diffractometer - X'Pert MRD  - Malvern Panalytical - high-resolution - image - 6
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Characteristics

Type
X-ray
Options
high-resolution

Description

The long and successful history of Malvern Panalytical's Materials Research Diffractometers (MRD) continues with a new generation – X’Pert³ MRD and X’Pert³ MRD XL. The improved performance and reliability of the new platform have added more analytical capability and power for X-ray scattering studies in: • advanced materials science • scientific and industrial thin film technology • metrological characterization in semiconductor process development Both systems handle the same wide range of applications with full wafer mapping up to 100 mm (X’Pert³ MRD) or 200 mm (X’Pert³ MRD XL). Features Future-proof system flexibility The X'Pert³ MRD systems offer advanced and innovative X-ray diffraction solutions from research to process development and process control. The used technologies make all systems field upgradable to all existing options and new developments in hardware and software to come. The standard research and development version for use with thin film samples, wafers (complete mapping up to 100 mm) and solid materials. High-resolution analysis capability is improved by the outstanding accuracy of a new high-resolution goniometer using Heidenhain encoders. The X'Pert³ MRD XL meets all the high-resolution XRD analysis requirements of the semiconductors, thin films, and advanced materials industries. Complete wafer mapping up to 200 mm is possible. The X’Pert3 version comes with longest liftetime of incident beam components (CRISP) and maximum uptime with pneumatic shutters and beam attenuators. By facilitating analysis of wafers of up to 300 mm in diameter, with a sophisticated, automatic wafer loader option,

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