Epoxy resin EP17HT-100

encapsulationsealingfor bonding

Master Bond EP17HT-100 is a one component epoxy system for potting, encapsulation, bonding and sealing applications with a curing temperature of 200-220°F or higher. This epoxy requires no mixing, is not premixed and frozen, feautres superb high temperature resistance, is highly dimensionally stable, conducts heat while still being electrically isolating and can be cast in thicknesses up to 1/2 inch. Key Features - Requires no mixing - Not premixed and frozen - Superb high temperature resistance - Highly dimensionally stable - Conducts heat while still being electrically isolating - Can be cast in thicknesses up to 1/2 inch Master Bond EP17HT-100 is a high performance, one part epoxy that combines easy handling with superb physical properties. The use of this epoxy is straightforward and simple. EP17HT-100 is not premixed and frozen and has unlimited working life at room temperature. It has a moderate viscosity with good flow properties, and can be used for potting and encapsulation in thicknesses up to 1/2 inch. Most importantly, EP17HT-100 cures in 60-90 minutes at 200-220°F, or 45-60 minutes at 275-300°F. Optimal properties are achieved with curing at 3-4 hours at 300°F followed by post curing at 350-400°F for a few hours, if possible. And, although the best properties are obtained by going with the higher temperature curing, the 200-220°F schedule still gives very good physical strength values along with first rate thermal conduction and electrical insulation numbers as well.