- Company
- Products
- Catalogs
- News & Trends
- Exhibitions
Epoxy adhesive EP3UFfor metalfor ceramicsfor plastics
Add to favorites
Compare this product
Characteristics
- Chemical composition
- epoxy
- Type of substrate
- for metal, for ceramics, for plastics, for composite materials
- Number of components
- single-component
- Technical characteristics
- low-viscosity, low outgassing, heat-cured, dimensionally stable, electrically insulating, thermally-conductive, chemical-resistant
- Applications
- industrial, for electronics, for the aerospace industry, for bonding
Description
Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes and features a low thermal resistance of 5-7 x 10-6 K•m2/W. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K and a volume resistivity exceeding 1014 ohm-cm. EP3UF also passes NASA low outgassing tests.
Catalogs
No catalogs are available for this product.
See all of Master Bond‘s catalogs
Related Searches
- Master Bond single-component adhesive
- Master Bond metal adhesive
- Master Bond industrial adhesive
- Master Bond plastic adhesive
- Master Bond glass adhesive
- Master Bond epoxy adhesive
- Master Bond dispersion adhesive
- Master Bond bonding adhesive
- Master Bond two-component adhesive
- Master Bond electronic adhesive
- Master Bond ceramic adhesive
- Master Bond sealing adhesive
- Master Bond fast curing adhesive
- Master Bond viscosity adhesive
- Master Bond conductivity adhesive
- Curing unit
- Master Bond rubber adhesive
- UV curing unit
- Cyanoacrylate glue
- Master Bond composite material adhesive
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.