Dual-curing adhesive UV22DC80-10F

epoxyfor metalglass

Master Bond UV22DC80-10F is a nanosilica filled, UV dual cure system with high dimensional stability. It may be used for high tech aerospace, electronics, optical and specialty OEM applications. Key Features • Thixotropic low viscosity • Meets NASA low outgassing specifications • Minimal shrinkage upon curing • Cures at 80°C in shadowed out areas Master Bond UV22DC80-10F is a nanosilica filled, UV dual cure system. The secondary cure is accomplished by adding heat, with the minimum temperature being 80°C. Essentially, this epoxy based system will cure readily upon exposure to UV light and if there are any shadowed out areas, heating at 80°C will complete the cure. The 80°C curing feature is particularly useful given the sensitivity of many plastics to elevated temperatures. UV22DC80-10F’s consistency can best be described as thixotropic, low viscosity. It dispenses readily, but it is not as free flowing as other systems. This UV is a cationic type cure and is not oxygen inhibited. It bonds well to a wide variety of substrates including metals, glass, ceramics and most plastics. UV22DC80-10F has very good chemical resistance to many acids, bases, fuels and solvents. It is a superb electrical insulator, also it is able to withstand rigorous thermal cycling. The service temperature range is -100°F to +350°F. Being a nanosilica filled system, it has exceptionally low shrinkage upon curing and stellar dimensionally stability.