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Epoxy adhesive EP4S-80for metalfor plasticsfor ceramics
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Characteristics
- Chemical composition
- epoxy
- Type of substrate
- for metal, for plastics, for ceramics, for composite materials
- Number of components
- single-component
- Technical characteristics
- low-viscosity, low outgassing
- Applications
- sealing, for coating, for bonding
- Working temperature
80 °C
(176 °F)
Description
Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements. EP4S-80 has a smooth flow and is easily brushable, making it ideal for EMI/RFI shielding and static dissipation. It is a silver filled epoxy with a curing temperature of 80°C.
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.