Epoxy adhesive EP5TC-80
for plasticsfor ceramicsfor composite materials

epoxy adhesive
epoxy adhesive
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Characteristics

Chemical composition
epoxy
Type of substrate
for metal, for plastics, for ceramics, for composite materials
Number of components
single-component
Technical characteristics
low outgassing, conductive, electrically insulating, thermally-conductive
Applications
for bonding, for electronics, sealing, automotive, for OEM, for the aerospace industry
Working temperature

Max.: 150 °C
(302 °F)

Min.: -50 °C
(-58 °F)

Description

Master Bond EP5TC-80 is a one component thermally conductive, electrically insulating epoxy with a curing temperature of 80°C. It has a flowable paste consistency and is used for bonding, sealing and small encapsulation applications. EP5TC-80 is a versatile system which can be used for bonding heat sinks to circuit boards, coils and motors, die attaching in optics, bonding SMDs, potting power modules and encapsulation of very small coils. It may be used to solve thermal management issues in aerospace, automotive, electronic, opto-electronic, and specialty OEM applications. Product Advantages: --Single component, no mixing needed --Flowable, can cure up to 1/4 inch thick --Low shrinkage --Highly dimensional stability --Passes NASA low outgassing

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