Master Bond EP5TC-80 is a one component thermally conductive, electrically insulating epoxy with a curing temperature of 80°C. It has a flowable paste consistency and is used for bonding, sealing and small encapsulation applications. EP5TC-80 is a versatile system which can be used for bonding heat sinks to circuit boards, coils and motors, die attaching in optics, bonding SMDs, potting power modules and encapsulation of very small coils. It may be used to solve thermal management issues in aerospace, automotive, electronic, opto-electronic, and specialty OEM applications.
Product Advantages:
--Single component, no mixing needed
--Flowable, can cure up to 1/4 inch thick
--Low shrinkage
--Highly dimensional stability
--Passes NASA low outgassing