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Epoxy adhesive EP5LTE-100for metalsingle-componenthigh-temperature
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Characteristics
- Chemical composition
- epoxy
- Type of substrate
- for metal
- Number of components
- single-component
- Technical characteristics
- low outgassing, high-temperature
- Applications
- for bonding, sealing, for filling applications
- Working temperature
Min.: -60 °C
(-76 °F)Max.: 175 °C
(347 °F)
Description
Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely high modulus. It has a thixotropic paste consistency making it ideal for bonding, sealing and gap filling applications. These properties are especially useful for opto-electronics or applications needing high dimensional stability and good heat resistance.
Key Features
--Unlimited working life at room temperature
--Electrically insulating
--Good flow properties
--NASA low outgassing
Catalogs
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.