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Epoxy adhesive EP5LTE-100
for metalsingle-componenthigh-temperature

Epoxy adhesive - EP5LTE-100 - Master Bond - for metal / single-component / high-temperature
Epoxy adhesive - EP5LTE-100 - Master Bond - for metal / single-component / high-temperature
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Characteristics

Chemical composition
epoxy
Type of substrate
for metal
Number of components
single-component
Technical characteristics
low outgassing, high-temperature
Applications
for bonding, sealing, for filling applications
Working temperature

Min.: -60 °C
(-76 °F)

Max.: 175 °C
(347 °F)

Description

Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely high modulus. It has a thixotropic paste consistency making it ideal for bonding, sealing and gap filling applications. These properties are especially useful for opto-electronics or applications needing high dimensional stability and good heat resistance. Key Features --Unlimited working life at room temperature --Electrically insulating --Good flow properties --NASA low outgassing

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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