Epoxy adhesive EP21ARHTND-2

for rubberfor plasticsfor ceramics

Two component epoxy adhesive, sealant and coating featuring exceptional resistance to acids Key Features * Paste consistency * Convenient handling * Superior temperature resistance * Good physical strength properties EP21ARHTND-2 is used in aerospace, electronic, electrical, chemical processing, and other applications where chemical resistance to acids is needed and a non-drip viscosity is helpful. Master Bond EP21ARHTND-2 is a two component epoxy resin system for high performance bonding, sealing and coating. It has a convenient 100 to 50 mix ratio by weight and is formulated to cure at ambient temperatures, or more quickly at elevated temperatures. Various cure schedules are noted in the chart below, with the optimum cure being overnight at ambient temperature followed by 2-4 hours at 150-200°F. The primary use of this system is for acid resistance, particularly sulfuric and hydrochloric acids. EP21ARHTND-2 has very low linear shrinkage upon cure, is 100% reactive, and contains no solvents or diluents.