Epoxy adhesive EP114

for plasticsfor ceramicsfor composite materials

Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity sealing applications. This optically clear compound features high dimensional stability due to its nano-silica filler material. It has been successfully tested for abrasion resistance per ASTM D4060-14 and readily withstands 1,000 hours at 85°C and 85% relative humidity. Key Features include: --Low viscosity and very long open time --Exceptionally low shrinkage upon curing --Superior dimensional stability --High glass transition temperature