Epoxy resin EP30FL

encapsulationfor electronic applicationssealing

The EP30FL model in the Master Bond Polymer System has a two-component epoxy resin design for casting, bonding, sealing, potting and encapsulation. It features low viscosity and high performance with no volatiles or solvents in the 100% reactive compound. The system is formulated to cure at room temperature. At elevated temperatures, it cures more rapidly with a four-to-one mix ratio by weight. The compound is recommended in areas in which low viscosity is a requirement for smooth application and castings, pottings and encapsulations must withstand thermal cycling or vibration. The bonds, castings and seals produced by EP30FL are durable, flexible and impressively resistant to chemicals such as oil and water, as well as to thermal cycling. This model is also suitable for cryogenic applications.