Two-component adhesive EP30LTE-LO

epoxyfor metalfor rubber

Key Features • Room temperature curing • Low shrinkage upon cure • Very low coefficient of thermal expansion • Superior dimensional stability • Passes fungus resistance MIL-STD-810G • Withstands 1,000 hours 85°C/85% RH Master Bond EP30LTE-LO is a specialty epoxy system featuring an exceptionally low coefficient of thermal expansion (CTE) that meets NASA low outgassing specifications. It can be used in bonding, coating, sealing and encapsulation applications. This lower viscosity system will cure at room temperature or more quickly at elevated temperatures. To optimize the properties, it is recommended to cure at room temperature for 12-24 hours, followed by a post cure of a few hours at 150-200°F. The CTE is in the range of 15-18 x 10-6 in/in/°C; markedly lower than other systems. Additionally, it has very good thermal conductivity and is highly electrically insulative. EP30LTE-LO is also noteworthy for its superior dimensional stability. Its linear shrinkage upon curing is exceptionally low, less than 0.01%. EP30LTE-LO bonds well to a wide variety of substrates including metals, glass, ceramics and many rubbers and plastics. It is 100% reactive and does not contain any solvents or diluents. This system offers excellent resistance to many chemicals, such as water, fuels and oils, as well as a number of acids and bases. It is serviceable over the wide temperature range of 4K to +250°F, enabling it to be using in cryogenic conditions. Part A of this system is off white in color and Part B is clear. Master Bond EP30LTE-LO is especially used in aerospace, optical, electronic, specialty OEM and other applications where an ultra low CTE along with low outgassing is desirable.