Epoxy resin EP3RRLV, EP30AO, EP37-3FLF

for electronic applicationsunderfill flip-chip

Master Bond’s line of epoxy underfill compositions aim to provide excellent under fill to die passivization, high reliability and excellent adhesion as well as to deliver improved mechanical support, lower the strain on solder joints and offer excellent moisture protection. In addition it offers high purity, low thermal expansion coefficient and out-gassing with a high glass transition temperature, high Young's module and a short cure cycle. It features high resistances to thermal cycling as well as shock and vibration. Additionally, some of the applications of this product include flip chip devices, ball grid arrays and chip scale packaging.