- Company
- Products
- Catalogs
- News & Trends
- Exhibitions
Epoxy adhesive EP21TDC-2LOtwo-component
Add to favorites
Compare this product
Characteristics
- Chemical composition
- epoxy
- Number of components
- two-component
Description
Master Bond EP21TDC-2LO, a room temperature curing, flexibilized, thermally conductive adhesive/sealant and encapsulant. This unique compound has superior tensile shear and peel strength. It has an elongation of less than 50% at 75°F and a Shore D hardness of 36. It offers exceptional resistance to chemicals, thermal shock and impact. The hardened composition is an excellent electrical insulator.
Catalogs
Related Searches
- Master Bond single-component adhesive
- Master Bond metal adhesive
- Master Bond industrial adhesive
- Master Bond plastic adhesive
- Master Bond glass adhesive
- Master Bond epoxy adhesive
- Master Bond dispersion adhesive
- Master Bond bonding adhesive
- Master Bond two-component adhesive
- Master Bond electronic adhesive
- Master Bond ceramic adhesive
- Master Bond sealing adhesive
- Master Bond fast curing adhesive
- Master Bond viscosity adhesive
- Master Bond conductivity adhesive
- Curing unit
- Master Bond rubber adhesive
- UV curing unit
- Cyanoacrylate glue
- Master Bond composite material adhesive
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.