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Epoxy adhesive EP21TDC-2LOtwo-component
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Characteristics
- Chemical composition
- epoxy
- Number of components
- two-component
Description
Master Bond EP21TDC-2LO, a room temperature curing, flexibilized, thermally conductive adhesive/sealant and encapsulant. This unique compound has superior tensile shear and peel strength. It has an elongation of less than 50% at 75°F and a Shore D hardness of 36. It offers exceptional resistance to chemicals, thermal shock and impact. The hardened composition is an excellent electrical insulator.
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.