Epoxy adhesive EP29LPSP
for metalglassfor ceramics

epoxy adhesive
epoxy adhesive
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Characteristics

Chemical composition
epoxy
Type of substrate
for metal, glass, for ceramics, for plastics
Number of components
two-component
Technical characteristics
low outgassing, electrically insulating, chemical-resistant
Applications
industrial, optical, for the aerospace industry, for cryogenic applications

Description

The EP29LPSP is a high-performance, two-component master bond polymer system. It is designed to be servicable as an adhesive, protective coating and sealant even in very low temperatures. Where it really stands out, however, is in its ability to withstand cryogenic shocks. The epoxy, which has a low viscosity and is optically clear, is designed to bond a variety of substrates including ceramics, metals, etc. Additional advantages include good insulation properties, a long working life of four or five hours, or more, and good chemical resistance. The bond system requires that the mixed epoxy be at room temperature, where it is followed by alternative cure cycles of lower elevated temperatures: eight to ten hrs @130(-150°F) or five to seven hrs @175°F, or three to five hrs @200°F.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.