Epoxy adhesive EP3HTMed
for metalglassfor ceramics

epoxy adhesive
epoxy adhesive
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Characteristics

Chemical composition
epoxy
Type of substrate
for metal, glass, for ceramics, for plastics
Number of components
single-component
Technical characteristics
heat-cured, electrically insulating, high-temperature, chemical-resistant, fast curing
Applications
medical

Description

EP3HTMed epoxy solution is a bonding system that enables versatile applications including sealing, coating, and sticking. It allows quick fix at minimum amount of time, consuming just 5 to 10 minutes at 300 degrees Fahrenheit and 20 to 30 minutes at 250 degrees Fahrenheit. It also exudes a strong shearing characteristic, with critical tolerance to autoclaving, chemical sterilants, radiation and Eto. It is a single-component concoction with independent bonding capacity. It operates infinitely at normal room thermal condition, and enables minimum cure at 250°F temperature, with a vast array of thermal adaptability that ranges between -60°F to +400°F. Its consistency allows even and smooth spread, and requires minimum requirement during the curing process, with contact pressure only needed in heat treatment. Key Features • One component, no mix system • USP Class VI certified • Passes ISO 10993-5 for cytotoxicity • Resists repeated sterilization Master Bond EP3HTMed is a one part system that combines easy processing with excellent physical strength and bonding properties. It fully meets USP Class VI specifications. It is easy to use as it does not require any mixing. It cures simply by heating from 250-300°F for a relatively short time as noted in the chart below. It should be emphasized that this is not a premixed and frozen type system. Its working life is unlimited as it will not cure until heated to the required temperature. Also, it has low shrinkage upon curing.

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