Polysulfide adhesive EP21TPND

for metalsingle-componenthigh-temperature

The Master Bond EP21TPND is an easy to apply, room temperature curing epoxy polysulfide that has a forgiving one to one mix ratio by weight or volume. Can be used as an adhesive, coating and sealant, the Master Bond EP21TPND offers an excellent toughness and flexibility that can withstand to a number of chemicals like water, gasoline, oil, fuels, hydrocarbons, hydraulic fluids and a lot of acids and bases. The Master Bond EP21TPND can withstand rigorous thermal cycling and mechanical and thermal shocks. In addition, with its curing temperature range of -80°F to +250°F, the EP21TPND has an excellent electrical insulation properties as it bonds to a wide variety of substrates like metal, glass, ceramics, rubber and plastic materials. The EP21TPND can be used in aerospace, chemical and other related industries.