Sputtering deposition machine OPTIvap

thermal evaporationion beam-assistedthin-film

• Flexible, modular system • Stand-alone (S) or glovebox integrated (G) • Building block for cluster tool • Multi-substrate & multi-mask processes • Standard uniformity: +/- 3 % (with specific geometry design up to +/1 %) • Substrate size up to 150x150 mm or diam. 150 mm (6“) for OPTIvap 4 • Substrate size up to 200x200 mm or diam. 280 mm (8“) for OPTIvap 6 • Complex multilayer devices (OLED,OPV) • Optical layers • Semiconductor, PV • OLEDs/Organic Electronics • OPVs • Batteries