Reflow soldering machine RK320

automaticfor electronic componentscompact

Reflow oven RK320 Technical Data Lead free yes Heating area max. 320 x 220 mm Heating system top und bottom - separated and selektive controled Clearance for assemblies max. 35 mm Heating controlling Free programmable for temperature curve setting Heat distribution high power heating element with force air heating method Cooling Dual channel air circulation for fast cool down process - exhaust port will be automatically open Heating temperatures 30 - 290 °C Soldering process time ca. 4 - 5 min per cycle of 300x200 mm PCB Rated power max. 3500 W / typ. 1000 W Features cost effective soldering process stores up any number of profiles fully automatic, fully static ( non moving rail ) operation for single or double side board soldering large transparent glass window see trought the soldering process Power requirements 210-230 VAC / 50-60Hz Dimension and wight 555 x 480 x 300mm / ca.30 kg