Reflow soldering machine RK360

automatedfor electronic componentscompact

Reflow oven RK360 Technical Data Lead free yes Heating area 460 x 410 mm Heating system top und bottom - separated and selektive controled Clearance for assemblies max. 35 mm Heating controlling Free programmable control for temperature curve setting Heat distribution high power heating element with force air heating method Cooling Dual channel air circulation for fast cool down process - exhaust port will be automatically open Heating temperatures 30 - 300 °C Soldering process time ca. 4 - 5 min per cycle of 300x200 mm PCB Rated power max. 3500 W / typ. 1200 W Features cost effective soldering process stores up any number of profiles fully automatic, fully static ( non moving rail ) operation for single or double side board soldering large transparent glass window see trought the soldering process Power requirements 220 VAC / 50Hz Dimension and wight 675 x 630 x 300mm / ca.55 kg